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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

WHMA Announces 2027 Annual Global Leadership Summit for Wire Harness Industry Leaders

09/16/2026 | Global Electronics Association
The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry. 

Celebrating One Year of the Advanced Electronic Packaging Technology Council (ADEPT): From Momentum to Measurable Impact

09/15/2026 | Devan Iyer, Global Electronics Association
Nearly 15 months ago, we launched the Advanced Electronic Packaging Technology Council with a simple premise: the packaging challenges facing our industry are moving too fast—and spanning too many disciplines—for any single company, region, or segment to solve alone. What we’ve seen since then is proof that focused, industry-led collaboration can turn urgency into alignment, and alignment into action.

Real Time with... THECA 2026: MUT Develops Thailand's Semiconductor Workforce

09/16/2026 | Real Time with... THECA
Panavy Pookaiyaudom, president of Mahanakorn University of Technology (MUT)—Thailand's equivalent to the U.S.'s MIT—discusses Thailand's engineering and skilled labor talent pipeline, MUT's involvement in the country's "Siam Silica" workforce initiative, and the country's ambitions in semiconductors and advanced manufacturing. Tasked directly with connecting MUT with professional associations such as THPCA and HKPCA as well as industry companies, Mr. Pookaiyaudom explains specific efforts aimed at developing skilled workers, attracting advanced electronics investment, and addressing long-term regional talent needs.

Microelectronics Network Launches Semiconductor Workforce Advisory Committee

09/15/2026 | SEMI
The National Network for Microelectronics Education (NNME) announced the formation of its inaugural Industry Advisory Committee, bringing together senior leaders from the semiconductor industry, universities, and community colleges to help guide the network's national workforce strategy and strengthen the talent pipeline supporting America's growing microelectronics ecosystem.
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