Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Alpha Assembly Solutions to Feature Innovative Solder Tech and Recycling Services at SMTA Monterrey Expo
August 29, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature its low temperature solder and void reduction solutions technologies, in addition to its solder debris recycling capabilities at the SMTA Monterrey Conference and Expo taking place on September 12, 2018 at the Hotel Crowne Plaza, Monterrey, Mexico.
Alpha will be promoting ALPHA OM-358 ultra-low voiding paste, a recent addition to Alpha’s Void Reduction Solutions technologies program. Designed for high reliability applications, this paste well suited for automotive, aerospace, LED, and medical customers. “Capable of achieving less than ten percent voiding on bottom terminated components, ALPHA OM-358 provides excellent electrical and thermal performance, increasing production efficiency and reducing the amount of rework,” said Robert Wallace, Regional Marketing Manager for the Americas. “We are pleased to provide a best-in-class paste which exceeds the voiding performance demands of our customers.”
Alpha’s expertise in low-temperature soldering will also be a focus, including its newest low temperature solder paste, ALPHA OM-550. Providing a solution for customers looking for SAC305-type mechanical and thermal reliability, this paste provides efficiencies in both energy and cost while improving BGA mechanical reliability, drop shock performance, and voiding on a variety of package types. During the Expo, Alpha will highlight The Printed Circuit Assembler’s Guide to... Low Temperature Soldering which was recently published and written by several low-temperature solder experts from Alpha.
In addition, Alpha will feature its Recycling Services program. Awarded an export license from SEMARNAT (the Department of Environment and Natural Resources in Mexico) to handle and transport nationalized scrap solder paste, debris, dross and other tin bearing materials, Alpha has expanded its recycling capabilities throughout Mexico. “This license is an important addition to our sustainabilty initiatives at Alpha,“ said Mitch Holtzer, Director of Reclaim Business. “As it increases the positive impact our recycling program can have on the rapidly expanding electronics assembly market in Mexico“.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
RELATED CONTENT:
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.