Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

USI and Cancon to Establish Server Component Company

04/11/2018 | Universal Scientific Industrial (Shanghai) Co. Ltd
Universal Scientific Industrial (Shanghai) Co. Ltd, the electronics manufacturing services (EMS) arm of ASE Group, and Cancon Information Industry Co. Ltd have signed a memorandum of cooperation to establish a joint venture for the purpose of advancing the R&D, design and production of safe and controllable server products.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in