Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Dr. Jennie Hwang to Discuss Solder Joint Reliability at SMTA International 2018
September 5, 2018 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: Less than a minute
Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products, from consumer to industrial, from computing to IoT, from medical to military applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intermetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
Dr. Jennie S. Hwang leverages her decades of comprehensive real-world experiences and deep knowledge to address solder joint reliability and the role of intermetallic compounds by integrating scientific fundamentals with practical requirements at the upcoming SMTA International 2018 event.
On October 15, Dr. Hwang will discuss relevant aspects of solder joint reliability at her PDC 13, Solder Joint Reliability – Principles and Applications, and PDC 19, Reliability of Electronics – The Role of Intermetallic Compounds. Attendees are encouraged to bring their own selected systems for deliberation.
For more information, contact Tanya Martin at tanya@smta.org. To register, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/03/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.