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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Apex August Sales Up 18% YoY
September 12, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
PCB manufacturer Apex International Co. Ltd has reported August 2018 sales of NT$1.19 billion ($38.68 million), up by 8.2% from the previous month's NT$1.099 billion ($35.7 million), and a jump of 18% year-on-year.
For January to August, total sales for Apex reached NT$7.126 billion ($231.65 million), up by 4.7% compared with the same period last year.
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Market Insights with Pluritec's Maurizio Bonati
04/23/2026 | Real Time with... APEX EXPONolan Johnson interviews Maurizio Bonati, VP of Sales at Pluritec, at APEX EXPO 2026. Bonati details Pluritec's three product divisions, covering a broad spectrum of PCB manufacturing. He discusses the current robust electronics market, driven by AI applications in Asia and technological investments in North America, while noting slower demand in Europe. The interview highlights key sectors like data centers, AI, and medical that benefit from advanced electronics.
PHOTO GALLERY: A Walk on the Lighter Side
04/23/2026 | I-Connect007APEX EXPO isn’t all business! To wrap up our last photo gallery, we’re sharing some of our favorites from the show—a walk on the lighter side. We’re highlighting those in-between moments: quick selfies, familiar faces reconnecting, robot dogs, booth-side laughs, and the kind of candid snapshots you only get when people are genuinely enjoying themselves. At the end of the day, it’s not just about what we do, it’s about the people we do it with.
India’s Vasantha Advanced Systems: EMS Success for 30 Years
04/22/2026 | Marcy LaRont, I-Connect007Based in one of India’s premier manufacturing regions, Vasantha Advanced Systems is an EMS provider that has built a reputation for quality, reliability, and long-term customer partnerships, earning repeated recognition from the Indian government through its National MSME Awards. Now, with a full spectrum of capabilities spanning PCB assembly, box build, and wire harness, and a workforce of more than 500, Vasantha is expanding its presence into the U.S. market. At APEX EXPO, I met Dr. Chidambaranathan and learned how this rising global player is positioning itself to meet the evolving needs of North American customers.
Advanced Electronics Packaging at APEX EXPO with Matt Kelly
04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/17/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.