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SemiGen Strengthens PCB Assembly, Test Capabilities
September 18, 2018 | SemiGenEstimated reading time: 2 minutes
After moving into their new state-of-the- art facility, SemiGen Inc., an ISO and ITAR registered outsource for RF and microwave contract assembly, automated PCB assembly (PCBA), wafer-processing, and key diodes, semiconductor devices, and bonding supplies, has made an additional capital investment of over a half million dollars in new production, wafer fab, and testing equipment to support customer demand.
The new equipment consists of improvements across their entire service platform and includes a new Mycronic MY300 pick-and-place system; two new Westbond wire bonders, a new Centrotherm eutectic vacuum chamber, new HTOL / HTRB ovens; as well as a new Disco DAD3220 dicing saw. In addition, they’ve made upgrades in their high-frequency testing department which includes several new pieces of performance testing and metrology tools.
"I'm excited to be in a position to continue to invest in and grow this important domestic outsource business," said Tim Filteau, president of SemiGen. "Our CEO, Jim Morgan, has said we must do our best to help our customers augment their design, assembly, and hi-rel testing and up-screening capabilities, and it feels great to see this new equipment getting up and running to do just that."
SemiGen is a USA-based outsource to OEMs in the RF/microwave, military, space, homeland security, optical, medical device, and commercial wireless markets. Their services and products are designed to fill voids in the manufacturing supply chain and production floor. SemiGen’s design and manufacturing center includes wire bonding to Si, GaAs, and GaN chips, RF/microwave and PCB assembly, mixed signal digital and analog assembly, module repair, and high frequency testing and upscreening services. In recent years, SemiGen has invested in coupling their services with in-stock product solutions by carrying the diodes, active and passive semiconductor devices, and bonding supplies needed for successful production of several types of solid-state, multi-function assemblies (MFAs) and components.
Their team helps with designs, builds prototypes, and handles volume production runs within new their 37,000 square foot facility in Manchester, New Hampshire. The facility also includes a class 10,000 clean room. Manual to fully automatic assembly solutions are now available.
With their recent upgrades in place, SemiGen is also offering wafer processing of silicon wafers, as well as processing ceramic substrates. Processing services provided include any combination of photolithography, wet etch, dry etch, metallization, grinding, polishing, and in-process metrology.
Their recent investments in their RF and Microwave testing and environmental screening lab has also enabled them to offer high-reliability (Hi-rel) screening of amplifiers, FETs, MMICs, transistors, diodes, and other RF and microwave components operating up into millimeter-wave frequencies.
Tests can be performed and delivered with full documentation in adherence with MIL-PRF-19500, MILPRF-38534, and MIL-PRF-38535 requirements. Element evaluation and screening options from Class H, Class K, TX, TXV, S-level, as well as custom SCD driven requirements, are available.
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Kopin Wins $21.5M Follow-on Contract for U.S.-Made Thermal Imaging Assemblies for Defense Prime
05/05/2026 | PRNewswireKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, announced it has been awarded a $21.5 million follow‑on production contract to manufacture a custom thermal‑imaging eyepiece assembly for a major U.S. defense prime contractor.