Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
July 23, 2025 | Federal ElectronicsEstimated reading time: 1 minute
Federal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
The MYPro A40DX is Mycronic’s flagship placement platform, designed to handle complex, multi-variant PCB assemblies with exceptional speed and accuracy. It delivers placement rates of up to 48,000 components per hour, combining volume-level throughput with quick changeover flexibility and making it a perfect fit for the dynamic needs of Federal Electronics’ OEM customers.
“This new addition is all about enabling smarter, faster manufacturing,” said Ed Evangelista, President of Federal Electronics. “The A40DX increases our ability to respond quickly to design changes and varied builds without sacrificing precision or quality.”
Federal’s Hermosillo facility plays a pivotal role in the company’s North American operations, offering cost-effective, nearshore manufacturing to OEMs across the U.S. The site is fully integrated with the company’s Cranston, Rhode Island headquarters via a unified ERP and IT infrastructure, ensuring real-time production visibility and synchronized workflows between both locations.
Staffed by more than 350 professionals, the Hermosillo site is optimized for high-mix, high-reliability assembly and currently supports a growing portfolio of AS9100-certified programs. The addition of the A40DX positions the facility to take on increasingly complex builds while maintaining fast turnaround and consistent quality.
This investment reflects Federal Electronics’ ongoing strategy to scale advanced manufacturing across its U.S. – Mexico footprint – supporting customers in aerospace, industrial, and medical sectors with agile, aligned, and high-performance solutions.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.