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Ascentech Exhibiting GEN3 Systems and INSPECTIS AB Process Solutions at SMTAI
September 18, 2018 | Ascentech, LLCEstimated reading time: 1 minute
Ascentech, LLC will will be exhibiting its GEN3 Systems Ltd. technology solutions as well as Inspectis AB products at SMTA International 2018 (SMTAI), October 16-17 at the Donald Stephens Convention Center, Rosemont, Illinois, USA. Ascentech’s booth is #723.
Ascentech will be highlighting the GEN3 Systems AutoSIR-2, surface insulation resistance (SIR) testing system, together with the full line of INSPECTIS camera systems, and will be demonstrating the latest Inspectis Pro-X Software Suite.
The Gen3 Systems AutoSIR 2 is the next generation instrument used to measure changes in Surface Insulation Resistance. The new system provides performance enhancements over earlier systems, including the ability to take measurements from all 256 channels in <8 seconds. It can test to all existing test specifications, e.g., IPC - IEC - JNC and other user specifications as well.
Inspectis Pro-X is an easy-to-use software developed for viewing live images and capturing still images and video from the full range of Inspectis HD, Full HD and 4K digital microscopes. In addition to image view and capture features, Inspectis software provides powerful tools for calibration of device magnification, geometrical measurements, live image overlays and annotations on still images.
About Ascentech, LLC
Ascentech, LLC is a technology and solutions provider and distributor to the electronics manufacturing and assembly industry with nearly 20 years’ experience. Ascentech is the North American distributor for Inspectis Optical Systems AB, Optilia Instruments AB, as well as GEN3 Systems, and also supplies the industry with other testing and process optimization solutions for electronics manufacturing. To learn more, click here.
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The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    