-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SEHO to Debut New Entry-Level Selective Soldering System at SMTAI
September 18, 2018 | SEHO Systems GmbHEstimated reading time: 2 minutes
SEHO Systems GmbH plans to exhibit at SMTA International, scheduled to take place October 16-17, 2018 in Rosemont, Illinois. The company will introduce the new StartSelective – the perfect plug-and-produce selective soldering system for those just entering automated soldering.
Connect, power on and produce. The StartSelective is thought through down to the last detail, from its compact design, ease of operation and many technical highlights. With a footprint of only 2.5 m², the StartSelective provides maximum quality and reproducibility of soldering results for assemblies up to 20“ x 20“ and an outstanding return on investment.
All process-relevant components such as the micro drop jet fluxer, preheat system and maintenance-free electromagnetic soldering unit have successfully been in use for years in other soldering systems from SEHO. While all process steps are fully automated and monitored, loading and unloading of assemblies is done manually.
The preheat section of the StartSelective is equipped with pulsar heaters over the full area that feature a high energy density and quick reaction time. This enables a remarkable reduction in energy consumption, especially in standby mode. A top-side heater allows processing of high-mass assemblies and can be activated individually with a pre-programmed temperature.
Another highlight is the optimized soldering area with non-wetted miniwave solder nozzles, featuring a 7° soldering angle. The nozzles convince with stable and reproducible flow properties resulting in outstanding soldering quality. Even difficult geometries can be soldered easily. Moreover, non-wetted solder nozzles are maintenance-free and feature a nearly unlimited lifetime, thus avoiding follow-up costs. Additionally, they do not require any chemicals for activation. An advantage for both the health of the maintenance staff and the environment.
Just like the high-volume selective soldering systems from SEHO, the StartSelective is equipped with a complete package for automated process control. The spray jet control in the fluxing area, automatic wave height control and solder level monitoring with automated solder wire supply are only some of the monitoring functions.
The StartSelective is designed for maximum efficiency. Programming is 100 percent offline at any PC workplace so that the machine is always available for production. Loading and unloading of assemblies is done from the front side, and all setup, retooling and maintenance are easily accessible on one side of the machine. This design allows users to integrate the StartSelective in any production island with minimum footprint requirements, or to place it as stand-alone system in the corner of the production floor.
For further information, please visit SEHO at SMTA International in booth #423 or click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.