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Saki Selects Jayson Moy as General Manager, Saki Asia Pacific
September 20, 2018 | Saki CorporationEstimated reading time: 1 minute
 
                                                                    Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that it has selected Jayson Moy as General Manager of Saki Asia Pacific Pte Ltd, Singapore. Moy has an extensive background in the electronics industry. As managing director for all aspects of Saki Asia Pacific, he'll be responsible for Saki's complete line of 2D and 3D automated solder paste, optical, and x-ray inspection and measurement systems. Saki Asia Pacific covers all of Asia, with the exception of Japan, Greater China, and Korea.
Prior to Saki, Moy was VP sales for CheckSum, based in Arlington, WA, and then in Singapore. Before that, Moy spent 20 years working for PVA. He was treasurer and operations director at PVA's headquarters in New York, managing director of PVA Asia based in Singapore, and started and set up the entire PVA Asia operation from staff to distribution network.
Moy received a BS degree in chemistry and an MBA in finance and R&D management from Rensselaer Polytechnic Institute, Troy, New York.
"Jayson brings a wealth of knowledge and experience to Saki," said Sakie (Jodie) Akiyama, president of Saki. "His technical expertise, finance and management background, and ability to understand the markets and needs of people and companies throughout Asia and in the United States, enhance the service and support he provides to Saki and its customers. Jayson is looking forward to working with electronics companies in the Asia Pacific area who need to ensure that their electronics assemblies and packages meet the highest quality standards."
See Saki at Productronica India, September 26-28, 2018, held at BIEC, Bengaluru, India, Hall 3, Booth PA07.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
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