Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Saki Selects Jayson Moy as General Manager, Saki Asia Pacific
September 20, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that it has selected Jayson Moy as General Manager of Saki Asia Pacific Pte Ltd, Singapore. Moy has an extensive background in the electronics industry. As managing director for all aspects of Saki Asia Pacific, he'll be responsible for Saki's complete line of 2D and 3D automated solder paste, optical, and x-ray inspection and measurement systems. Saki Asia Pacific covers all of Asia, with the exception of Japan, Greater China, and Korea.
Prior to Saki, Moy was VP sales for CheckSum, based in Arlington, WA, and then in Singapore. Before that, Moy spent 20 years working for PVA. He was treasurer and operations director at PVA's headquarters in New York, managing director of PVA Asia based in Singapore, and started and set up the entire PVA Asia operation from staff to distribution network.
Moy received a BS degree in chemistry and an MBA in finance and R&D management from Rensselaer Polytechnic Institute, Troy, New York.
"Jayson brings a wealth of knowledge and experience to Saki," said Sakie (Jodie) Akiyama, president of Saki. "His technical expertise, finance and management background, and ability to understand the markets and needs of people and companies throughout Asia and in the United States, enhance the service and support he provides to Saki and its customers. Jayson is looking forward to working with electronics companies in the Asia Pacific area who need to ensure that their electronics assemblies and packages meet the highest quality standards."
See Saki at Productronica India, September 26-28, 2018, held at BIEC, Bengaluru, India, Hall 3, Booth PA07.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.