Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Saki Selects Jayson Moy as General Manager, Saki Asia Pacific
September 20, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that it has selected Jayson Moy as General Manager of Saki Asia Pacific Pte Ltd, Singapore. Moy has an extensive background in the electronics industry. As managing director for all aspects of Saki Asia Pacific, he'll be responsible for Saki's complete line of 2D and 3D automated solder paste, optical, and x-ray inspection and measurement systems. Saki Asia Pacific covers all of Asia, with the exception of Japan, Greater China, and Korea.
Prior to Saki, Moy was VP sales for CheckSum, based in Arlington, WA, and then in Singapore. Before that, Moy spent 20 years working for PVA. He was treasurer and operations director at PVA's headquarters in New York, managing director of PVA Asia based in Singapore, and started and set up the entire PVA Asia operation from staff to distribution network.
Moy received a BS degree in chemistry and an MBA in finance and R&D management from Rensselaer Polytechnic Institute, Troy, New York.
"Jayson brings a wealth of knowledge and experience to Saki," said Sakie (Jodie) Akiyama, president of Saki. "His technical expertise, finance and management background, and ability to understand the markets and needs of people and companies throughout Asia and in the United States, enhance the service and support he provides to Saki and its customers. Jayson is looking forward to working with electronics companies in the Asia Pacific area who need to ensure that their electronics assemblies and packages meet the highest quality standards."
See Saki at Productronica India, September 26-28, 2018, held at BIEC, Bengaluru, India, Hall 3, Booth PA07.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.