-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young to Demo True 3D Inspection for a Smart Factory at SMTAI
September 25, 2018 | Koh Young AmericaEstimated reading time: 2 minutes

Koh Young America will highlight its industry-leading Full 3D inspection solutions and next-generation closed-loop KSMART process optimizer (KPO) at SMTA International on October 16-17 in Rosemont, Illinois. Conference attendees are cordially invited to visit booth 815 and learn how industry-leading 3D measurement systems and closed-loop process solutions from Koh Young Technology can help improve production throughput and yield.
If you are flying to the show, be sure to watch TalkBusiness 360 on the American Airlines inflight entertainment system. During the entire month of October, the segment will feature Koh Young as an "Industry Innovator," highlighting its KSMART Process Optimizer. The TalkBusiness channel will also feature Koh Young with streaming services from Apple TV, Roku, and Amazon Fire TV through December.
8030-3 3D SPI Solution
At the show, Koh Young America will demonstrate the industry’s fastest true 3D measurement and inspection solution. The 8030-3 Solder Paste Inspection (SPI) solution combines multi-projection moiré technology with Full 3D data-based process optimization and analytics to eliminate false calls and boost throughput. We will also highlight our flagship aSPIre3 with a feature set suitable for myriad challenges in demanding production environments in-line at booth 407 with Fuji America. These systems continue to raise the benchmark standards in the industry.
Zenith 3D AOI Solution
Several Koh Young Automated Optical Inspection (AOI) solutions will complement the revolutionary SPI equipment on display. Consisting of multiple models targeting different production needs, Koh Young will emphasize the Zenith platform – the world’s best-selling and first True 3D AOI platform. The hardware technology and measurement algorithms within the Zenith series work together to identify defect sources and provide accurate inspection of components, joints, and more, regardless of the model.
Smart Factory Solution
Koh Young is leading the effort to harness the power of connectivity and create a smart factory. For instance, its KSMART Process Optimizer (KPO), which is using Koh Young AI-powered machine learning, includes interlinking software modules that exercise complex algorithms to develop closed-loop process recommendations. The Machine-to-Machine (M2M) connectivity drives the smart factory vision one step further by enabling automatic SMT line adjustments. Finally, working with its printer and mounter partners, Koh Young has developed the connectivity tools to connect with multiple suppliers and simplify communication across the entire PCBA line. During the SMTA International technical conference on Thursday, 18October in the INS2 (Inspection 4.0) session, Koh Young will present the benefits of combining SPI and AOI measurement feedback with the inline printer and mounters for a revolutionary approach for Advanced Process Control (APC) that drives process improvements.
About Koh Young
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, semiconductor manufacturing, machining and assembly process manufacturing, and various medical fields. In addition to the corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support Koh Young Technology users.
If you cannot attend SMTA International and visit us in Booth 815, you can learn more about Koh Young Technology and its best-in-class inspection solutions here, but don’t forget to tune into TalkBusiness 360 for the Industry Innovator segment featuring Koh Young.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.