Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
TopLine Launches Low Void Solder Columns
September 28, 2018 | TopLineEstimated reading time: 1 minute
TopLine has announced the availability of new low-void solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.
Martin Hart, CEO of TopLine, says that “The low-void nature of the columns isn’t visible or apparent from the exterior; the consistency exists inside the structure. These columns are stronger than ones with a higher incidence of voids, and strength is what our customers want.” Solder columns are 10x more reliable that solder balls, he adds, when attaching large size ceramic IC packages to FR-4 or polyimide PC Boards operating in harsh environments. The large CTE (Coefficient of Thermal Expansion) mismatch of ceramic puts stress on the interconnections (I/O) over wide temperature cycles.
Eventually, the connections between the ceramic IC and the mother board will break over time after enduring thousands of temperature cycles. “Solder columns are compliant and absorb CTE mismatch, thereby lengthening the life of the circuit.”
Additionally, the new low-void solder columns exceed the requirements of Mil-STD-883K. This standard establishes uniform methods for testing microelectronic devices and components suitable for use within military and aerospace electronic systems, with an emphasis on ensuring a uniform level of quality and reliability suitable to the intended applications.
TopLine offers a wide range of solder columns to meet individual needs. Typical solder core materials include both Pb90/Sn10 as well as Pb80/Sn20.
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Share on:
Suggested Items
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).