Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Saki to Demo Self-Programming AOI, SPI Software at SMTAI 2018
October 1, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will present its new 3Di automated optical inspection (AOI) system at the Fuji America booth number 407, at SMTA International. Saki’s AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality.
Saki’s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.
Programming is as easy as SSP—Saki Self-Programming Software, the first self-programming software for AOI and SPI. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated. Demonstrations of the software will be available.
Also on display will be a video of Saki’s new 3D automated solder paste inspection (SPI) and 3D automated x-ray inspection (AXI) systems.
“We have been working with Fuji for many years to ensure true M2M communication,” said Satoshi Otake, general manager of Saki America. “Before true M2M communication, inspection equipment only had to report good or no good. With M2M, that’s not sufficient. An actual measurement is required along with a record for traceability. For the measurement to be correct, the data converted back to the pick-and-place machine must be correct. This process needs to be automated and reside with the inspection equipment. The reliability of the data is the very basis of M2M communication. Saki’s inspection and measurement systems provide that measurement accuracy and reliability.”
SMTA International is being held October 16-17, 2018 at the Donald Stephens Convention Center, Rosemont, Illinois.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki’s 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.