SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
Punching Out: What Buyers Are Buying
‘Deepfake’ ComponentsSaki to Demo Self-Programming AOI, SPI Software at SMTAI 2018
October 1, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will present its new 3Di automated optical inspection (AOI) system at the Fuji America booth number 407, at SMTA International. Saki’s AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality.
Saki’s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.
Programming is as easy as SSP—Saki Self-Programming Software, the first self-programming software for AOI and SPI. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated. Demonstrations of the software will be available.
Also on display will be a video of Saki’s new 3D automated solder paste inspection (SPI) and 3D automated x-ray inspection (AXI) systems.
“We have been working with Fuji for many years to ensure true M2M communication,” said Satoshi Otake, general manager of Saki America. “Before true M2M communication, inspection equipment only had to report good or no good. With M2M, that’s not sufficient. An actual measurement is required along with a record for traceability. For the measurement to be correct, the data converted back to the pick-and-place machine must be correct. This process needs to be automated and reside with the inspection equipment. The reliability of the data is the very basis of M2M communication. Saki’s inspection and measurement systems provide that measurement accuracy and reliability.”
SMTA International is being held October 16-17, 2018 at the Donald Stephens Convention Center, Rosemont, Illinois.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki’s 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Share on:
Suggested Items
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
The SD11 Inkjet Printer and Ventec Giga Solutions
10/10/2024 | Marcy LaRont, PCB007 MagazineVentec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.
SolderKing Celebrates a Milestone of Growth and Innovation in Soldering Solutions
10/10/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating six years of growth and success in the electronics and industrial manufacturing sectors.
ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
10/08/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.