Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Saki to Demo Self-Programming AOI, SPI Software at SMTAI 2018
October 1, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will present its new 3Di automated optical inspection (AOI) system at the Fuji America booth number 407, at SMTA International. Saki’s AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality.
Saki’s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.
Programming is as easy as SSP—Saki Self-Programming Software, the first self-programming software for AOI and SPI. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated. Demonstrations of the software will be available.
Also on display will be a video of Saki’s new 3D automated solder paste inspection (SPI) and 3D automated x-ray inspection (AXI) systems.
“We have been working with Fuji for many years to ensure true M2M communication,” said Satoshi Otake, general manager of Saki America. “Before true M2M communication, inspection equipment only had to report good or no good. With M2M, that’s not sufficient. An actual measurement is required along with a record for traceability. For the measurement to be correct, the data converted back to the pick-and-place machine must be correct. This process needs to be automated and reside with the inspection equipment. The reliability of the data is the very basis of M2M communication. Saki’s inspection and measurement systems provide that measurement accuracy and reliability.”
SMTA International is being held October 16-17, 2018 at the Donald Stephens Convention Center, Rosemont, Illinois.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki’s 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.