-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki to Demo Self-Programming AOI, SPI Software at SMTAI 2018
October 1, 2018 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will present its new 3Di automated optical inspection (AOI) system at the Fuji America booth number 407, at SMTA International. Saki’s AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality.
Saki’s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.
Programming is as easy as SSP—Saki Self-Programming Software, the first self-programming software for AOI and SPI. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated. Demonstrations of the software will be available.
Also on display will be a video of Saki’s new 3D automated solder paste inspection (SPI) and 3D automated x-ray inspection (AXI) systems.
“We have been working with Fuji for many years to ensure true M2M communication,” said Satoshi Otake, general manager of Saki America. “Before true M2M communication, inspection equipment only had to report good or no good. With M2M, that’s not sufficient. An actual measurement is required along with a record for traceability. For the measurement to be correct, the data converted back to the pick-and-place machine must be correct. This process needs to be automated and reside with the inspection equipment. The reliability of the data is the very basis of M2M communication. Saki’s inspection and measurement systems provide that measurement accuracy and reliability.”
SMTA International is being held October 16-17, 2018 at the Donald Stephens Convention Center, Rosemont, Illinois.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki’s 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.
Suggested Items
AIM to Participate in SMTA Ultra High Density Interconnect Symposium
01/15/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability