Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Zymet to Discuss Reliability of LTS Assemblies at SMTAI
October 9, 2018 | ZymetEstimated reading time: 1 minute
At the SMTA International 2018 technical conference, Portland State University, Zymet Inc., and MK Electron Co. Ltd will present their investigation on the board level reliability of low temperature solder (LTS) assemblies and the efficacy of a reworkable edgebond adhesive to enhance reliability. LTS assembly results in less warpage and, hence, fewer assembly defects. It also offers a path to board level assembly of modules, without subjecting them to their first-level reflow conditions. One disadvantage of low temperature solders is poorer board level reliability, particularly for harsher environments.
The -40°C to +125°C thermal cycle performance of BGA’s assembled with LTS is compared with those assembled with conventional SAC solder. Non-edgebonded LTS assemblies (Figure 1a) are compared with those bonded with a reworkable edgebond adhesive (Figures 1b and 1c). The expected lower performance of LTS, relative to SAC solder, is confirmed. The reworkable edgebond adhesive, when applied to LTS-assembled BGAs, is found to improve performance to levels well beyond that of SAC-assembled non-edgebonded BGAs. With appropriate adhesive selection and configuration, LTS-assembled BGAs can meet more difficult board level reliability requirements, even those of a harsh environment application.
The paper, "Low Melting Temperature Interconnect Thermal Cycle Performance Enhancement Using Elemental Tuning and Edgebond Application", will be presented at Session APT7: Reliability of Low Temperature Solder (LTS) Interconnects, October 18, 2018. For more information about edgebond adhesives, visit Zymet at Booth #828, SMTAi 2018, Rosemont Convention Center, Rosemont, Illinois, October 14 -18, 2018.
About Zymet
Zymet is a global supplier of adhesives and encapsulants, focused on the development and manufacture of enabling materials for the electronics industry.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.