Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Seica Publishes Video about the New Compact Slim Next> series
October 10, 2018 | SeicaEstimated reading time: 1 minute
In our new row of educational videos, we introduce today the Compact Slim Next> series, a very small (only 300 mm width) yet modular bed of nails tester especially suitable for deployment in as a series of equivalent systems, loaded either manually or via a COBOT solution.
The system features a 180×300 mm test area with an automated receiver specifically conceived for robotized loading. There are 14 slots available for the ATE instrumentation, up to 6 user power supply units and an integrated control and management unit.
With a small size: 300 mm width, 762 mm height it is scalable: suitable for serial installation of equivalent systems.It can be used with cobot, robot or in manual mode with a sliding receiver for robot loading. With a test area 180 x 300 mm and 14 slots also available for ATE instruments.
In the line with Industry 4.0 Standards
All of the Next> series solutions have Seica’s Industrial Monitoring Solution on board, with the potential for remote monitoring of current and voltage consumption, mains supply, temperature, light indicators and other parameters useful to indicate correct operation, to provide information enabling predictive maintenance and in general to render the systems compatible with today’s Industry 4.0 standards.
Watch the video here:
About Seica
Founded in 1986, Seica S.p.A. is an innovative, high technology company that develops and manufactures leading-edge solutions for the test and selective soldering of electronic boards and modules. Combining deep expertise in electronics technology as well as in industrial machines and processes has enabled Seica to become a global leader and supplier of test and manufacturing solutions, with an installed base of more than 2000 systems on 4 different continents. Seica has fully embraced the concept of Industry 4.0, developing solutions to monitor and collect information from machines and industrial plants to enable the optimization of manufacturing processes, maintenance and energy management. Company headquarters are located in Strambino, Italy, with direct offices in USA, Germany, China, Mexico and France, supported by a vast distribution network covering the rest of the world. Since 2014, the Seica Group includes Seica Automation, located in Milan, which designs and manufactures board handling systems and other automation equipment for the electronics manufacturing industry.
For more information, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Critical Minerals: The New Power Play in Global Trade
10/13/2025 | Marcy LaRont, I-Connect007Access to critical minerals essential for electronics manufacturing, and China’s monopoly of them, is increasingly under scrutiny, with gallium (Ga) and germanium (Ge)at the forefront of this discourse. However, all critical minerals imported from China share a similar narrative, and understanding the implications of this dependency and the risks to both U.S. commercial and defense sectors has created an urgent need for a comprehensive electronics strategy to secure and diversify access to these vital minerals. In this candid interview, USPAE Executive Director Jim Will discusses the issues and the mitigation steps that must be taken to adequately address them.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
SASinno Americas Strengthens Field Service Capabilities with Addition of Oscar Ortiz González in Mexico
10/10/2025 | SASinno AmericasSASinno Americas is proud to announce the addition of Oscar Ortiz González as Senior Field Service Engineer, based in Mexico.