-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Enthone to Exhibit and Present at TPCA Show 2018
October 10, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will exhibit at the TPCA tradeshow and present a technical paper at the IMPACT 2018 Conference, co-located with TPCA in Taipei, October 24−26, 2018.
MacDermid Enthone has invested in the research of innovative manufacturing processes to meet the demanding standards of an ever shrinking circuit board. Kesheng Feng PhD, Director of Research, Metallization, will be presenting “Electroplating Processes For IC Substrates—Embedded Trace Plate, Via Fill and Through-Hole Fill“ on October 24, 14:55 – 15.10, The paper will be presented in Session S2, Room 504 and covers a broad range of topics involving the challenges presented by the advanced metallization requirements for today’s most advanced PCBs, including SL-PCB, MSAP, and traditional IC substrate designs.
MacDermid Enthone process specialists will be on hand to discuss the chemistries and materials we offer throughout the entire electronics supply chain. Among the showcased products will be the latest MacuSpec printed circuit board metallization processes, the advanced Systek metallizations for ultra high performance via filling, embedded trace plating, and bump metallizations, as well the latest final finish and lead frame based packaging innovations. Guests can also drop by to request information about MacDermid Enthone’s complete portfolio of chemical processes for MSAP. Experts from the Alpha Assembly Solutions business will also be present in our shared booth to talk about their low temperature solder alloys, the EV focused silver sintering technology, and their wide range of assembly products. These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Learn more at booth #K205.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t—MacDermid Enthone is there. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is a global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. For more information, click here.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.