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Metcal Introduces New Connection Validation Soldering System
October 11, 2018 | MetcalEstimated reading time: 1 minute
Metcal has introduced the new CV-500 Connection Validation Soldering System, the companion station to the CV-5210 CV Soldering System. The CV-500 packs all of the connection validation technology into a compact, economical housing.
The intermetallic compound thickness is critical in the formation of a solder joint. Connection validation (CV) is a patented technology that evaluates the quality of the solder joint by calculating the intermetallic compound formation and provides closed loop feedback to the operator.
The CV-500 soldering system excels at SMD touch-up and small component rework using the Ultrafine hand-piece and Ultrafine tweezer hand-piece (both sold separately). The CV-500 system also features Smartheat power on demand technology, a 2.8" color touchscreen with bold graphics, an integrated net power meter with optional tip temperature display and much more.
The CV-500 is compatible with Metcal’s eight hand-pieces and upgrade kits for the CV soldering system. These ergonomic hand-pieces transform the CV system into a complete soldering solution for a wide variety of applications.
About Metcal
Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.