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Alpha to Feature Recycling Services and Low Void Technology at SMTA Orange County Expo
October 12, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions, the world leader in the production of electronic assembly materials, will feature its Void Reduction Solutions technologies and solder debris recycling capabilities at the Orange County Expo and Tech Forum taking place on Thursday, November 1 at The Grand in Long Beach, California.
At the Expo, Alpha will be promoting its Void Reduction Solutions (VRS) program, a program designed to help manufacturers meet the demaning void requirements of their customers. Alpha’s latest ultra-low voiding paste, ALPHA® OM-358 is the latest addition to the VRS tool kit which includes a variety of products and processing solutions.
ALPHA® OM-358 was engineered for high reliability applications, and well suited for automotive, aerospace, LED, and medical applications. “This paste achieves less than ten percent voiding on all types of bottom terminated components.”, said Robert Wallace, Regional Marketing Manager for the Americas. “With excellent electrical and thermal performance, ALPHA® OM-358 increases production efficiency and reduces the amount of rework, a significant beneift for our customers.“.
Alpha will also feature its Recycling Services program. As part of Alpha’s sustainability initiatives, Alpha recycles scrap solder paste, debris, dross, and other tin-bearing materials from manufacturers throughout North America, and recently expanded its recycling capabilities throughout Mexico, having received an export license from SEMARNAT, the Department of Environment and Natural Resources in Mexico, to handle and transport nationalized scap material. “The recycling market continues to expand throughout the Americas,“ said Mitch Holtzer, Director of Reclaim Business, “Our goal is to make the recycling process simple for manufacturers, allowing recycling to become a realistic and attractive alternative to sending materials to land-fills.“.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.