Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Cogiscan Software Enables Industry 4.0; Will Exhibit at SMTA Guadalajara
October 15, 2018 | Cogiscan Inc.Estimated reading time: 1 minute
Cogiscan Inc. will exhibit with InterLatin at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018. The company will discuss the latest significant developments on its CO-NECT connectivity platform and Factory Intelligence software at the InterLatin booth.
The new Factory Intelligence — Analytics package offers a series of capabilities to analyze metrics and KPIs over a period of time. Being able to collect and analyze key metrics such as machine OEE is key to enabling manufacturing staff to quickly identify any deviation from expected performance and quickly drill down to the root cause for corrective actions. This will guarantee that all assets always operate at optimal conditions.
Cogiscan’s Co-NECT supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, CFX as well as proprietary interfaces from leading software and machines vendors. Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly.
Factory Intelligence runs on the standard Cogiscan platform, which means that it is a very simple upgrade for existing Cogiscan customers. With the largest library of machine interfaces in the industry, Cogiscan can deliver a complete solution; including connectivity middleware and applications such as material control, traceability and analytics.
About Cogiscan Inc.
Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry. The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs. Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years. For more information, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SMTA Announces 2026 STAR Forum Technical Program
04/16/2026 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 6-7, 2026 in Olathe, Kansas, USA.
Breaking the Manual Quoting Bottleneck in Wire Harness
04/15/2026 | Nolan Johnson, SMT007 MagazineArik Vrobel has spent more than 35 years in wire harness manufacturing—starting in EL-Com, his father's shop, building it into a nationally recognized contract manufacturer, and ultimately selling to Aptiv/Winchester in 2021. But retirement didn't last long. Within months, Arik was back, not as a manufacturer this time, but as a technologist. His new company, Cableteque, is building the quoting and data automation platform he always wished existed.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
New EIPC President: Building Strength Through Unity in Europe’s Electronics Industry
04/14/2026 | Marcy LaRont, I-Connect007Industry veteran Rico Schluter, newly appointed president of EIPC, discusses his decades-long journey through the European PCB industry and his vision for its future. From building advanced manufacturing operations to leading large-scale facility development in Lithuania, Rico shares insights into automation, workforce evolution, and the challenges of scaling production. He emphasizes the urgent need for stronger collaboration across European industry organizations to effectively influence policy in Brussels, particularly around supply chain resilience, trade regulations, and energy-related incentives.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.