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Flexible Thinking: Designing Flex Circuits for Dynamic Reliability

04/09/2026 | Joe Fjelstad -- Column: Flexible Thinking
Flex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.

My Top 7 Takeaways from APEX EXPO 2026

04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics Association
I’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.

APEX EXPO Opens Today With Ribbon Cutting and Sold-Out Show Floor

03/17/2026 | Michelle Te, I-Connect007
APEX EXPO officially opens today with a ribbon-cutting ceremony welcoming attendees onto the sold-out show floor in Anaheim, California. Standards committee meetings and professional development courses have been underway since the weekend, but Tuesday marks the official opening of the exhibition as more than 400 exhibitors prepare to showcase their latest equipment, materials, and technologies across 140,000 square feet of exhibit space.

Finding Your Marketing Niche in a Crowded PCB Industry

03/10/2026 | Richard Nichols, GreenSource Engineering
I recently made a flippant comment on LinkedIn, “All marketing and no trousers,” hinting that marketing campaigns often do not have a tangible product to market and the campaign is marketing a concept or a gut feeling. For PCB and IC substrate manufacturers, this poses a great risk for unsuccessful campaigns and the opportunity to innovate in an increasingly competitive and global landscape.

Beyond the Board: How Advanced PCB Design Is Reshaping Mil/Aero Electronics

03/10/2026 | Jesse Vaughan -- Column: Beyond the Board
As mil/aero electronics evolve toward higher data rates, greater processing density, and tighter mechanical envelopes, integration is no longer occurring primarily at the box level, but rather deep within the electronic architecture itself, often beginning at the printed circuit board.
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