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BTU Picks Up Another Award for its Profile Guardian Software
October 17, 2018 | BTU International, Inc.Estimated reading time: 1 minute
BTU International Inc. was awarded a 2018 Global Technology Award in the category of Software – Process Control for its Profile Guardian Redundant Process Monitor. The award was presented to the company during a Tuesday, October 16, 2018, ceremony that took place during SMTA International.
The software pairs a thermocouple probe at product height with software to monitor temperature deviation from baseline –fully independent from control TCs. The redundant process monitor is aware of oven state (recipe change, energy savings modes, etc.), and monitor data can be included in host communications (MES) from the oven.
Additionally, it provides board level traceability when paired with bar code readers, which is a requirement for many large OEM/EMS customers.
"We are so pleased that Profile Guardian has been recognized again by the industry," said Paul Lancaster, director of sales for the Americas at BTU. "Our customers, some of the largest automotive OEMs and EMS manufacturers, felt strongly that a simplified, and fully integrated redundant monitoring system was needed for their BTU reflow ovens. The Profile Guardian fulfills that request and is performing beyond expectations."
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
For more information about BTU International, click here.
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Empowering Interns: Shaping Tomorrow's Tech
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OE-A Elects New International Board of Directors
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New IPC White Paper Focuses on Use of Artificial Intelligence in Automated Optical Inspection in Electronics Manufacturing
02/06/2025 | IPCA new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs). According to data within the white paper, recent advancements in technology, particularly in Cloud AI, IoT and Smart Manufacturing, have provided opportunities to further enhance AOI performance.