-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Thermaltronics Wins Global Technology Award for Soldering Robot
October 17, 2018 | ThermaltronicsEstimated reading time: 2 minutes
Thermaltronics USA, Inc. was awarded a 2018 Global Technology Award in the category of soldering equipment – other for its TMT-R9800S soldering robot. The award was presented to the company during a Tuesday, October 16, 2018 ceremony that took place during SMTA International.
Unlike typical Cartesian robots developed from dispensing technology that do not have precision Z-axis control, the Thermaltronics TMT-R9800S Soldering Robot is equipped with full vision to verify the procedure being undertaken and does not simply follow a pre-determined program. The system incorporates innovative design concepts and precision components to ensure accuracy and repeatability of soldering processes. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs. Features include:
- Dual-arm, six axis soldering robot
- Intelligently compensates for PCBA variance
- Image recognition & mapping system
- Laser height measurement
The soldering robot has an observation mode, a verification mode and decision making capabilities. This capability to collect and utilize data for production processing is one of the most important factors necessary to meet the requirements of Industry 4.0 standards.
Thermaltronics curie heat technology (CHT) responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. The company’s hand soldering products include both 13.56 MHz and 470 KHz power supplies and are fully compatible with competitive product offerings.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
In addition to the hand soldering product line, Thermaltronics also provides an extended range of accessories to support both production and rework applications.
About Thermaltronics USA, Inc.
Thermaltronics is a manufacturer and supplier of a wide range of soldering products and accessories used in the electronics manufacturing industry. Design and development is undertaken in the USA and Australia, with final production taking place in a customized manufacturing facility, incorporating specialized equipment and in accordance with recognized international standards of quality and compliance.
In addition to the modern factory, Thermaltronics maintains an office and warehouse in New York State, commercial offices in Hong Kong and a Distribution Sales Office in Perth Australia.
All Thermaltronics products are produced in accordance with ISO 9000 & ISO 14000 standards and meet either TUV, GS, CE or NRTL safety requirements. Strict quality control procedures are in place and product warranties are among the best in the industry. For more information, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.