Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
IPC Releases 2019 Standards Committee Meeting Schedule
October 18, 2018 | IPCEstimated reading time: 1 minute
Because IPC APEX EXPO will be held in January for the next five years, IPC will move its standards development committee meetings normally scheduled in Fall to June in 2019. This decision follows a survey of the standards committees where respondents indicated they would prefer to hold in-person standards development meetings in the summer months to have ample time to work on documents. IPC previously hosted its Fall Committee Standards Development meetings in conjunction with SMTA International.
“IPC’s standards committee leaders and members said they would appreciate having in-person standards development meetings spread over the course of six months, allowing them ample time to work on standards activities via e-mail and teleconference in between the in-person events,” said John Mitchell, IPC president and CEO.
“SMTA has been a gracious host and provided a perfect setting for IPC’s Fall Committee Meetings in the Chicago area for many years. We thank them for this partnership and look forward to working with the association on other events, such as the upcoming High-Reliability Cleaning and Conformal Coating Conference next month,” added Mitchell.
IPC’s Summer Standards Development Committee Meetings will take place June 15-20, 2019 in Raleigh, N.C. IPC’s next in-person committee meetings will take place January 26-31, 2019 at IPC APEX EXPO in San Diego. For more information on IPC standards and standards development activities, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.