-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ACDi Strengthens Capabilities of Maryland Facility
October 22, 2018 | PRNewswireEstimated reading time: 1 minute
ACDi has added three new pieces of equipment to their Frederick, Maryland headquarters. The company has purchased, installed and is fully operating Optical Control’s SMD X-Ray Counting Machine, Koh Young’s 3D Solder Paste Inspection Machine and the Zenith3D Automated Optical Inspection Machine.
The Optical Control SMD X-Ray counting machine provides exact inventory knowledge which in turn enables more efficient production and increased on-time delivery. The OC-SCAN®CCX.3 significantly streamlines the electronics manufacturing process and gives an exact outline of single component stocks.
The 3D solder paste inspection system from Koh Young is the fastest solder paste inspection machine available with 3D shadow-free moiré technology, warp compensation and a user-friendly Renewal GUI. It delivers true 3D inspection without concern for inaccuracies resulting from shadowing.
Koh Young’s Zenith 3D automated optical inspection (AOI) platform effectively measures true pro lometric component shapes, foreign materials, patterns and solder joints on assembled PCBs to overcome the vulnerabilities and shortcomings of 2D AOIs.
“With the addition of these systems to our electronics manufacturing facility, the company is adopting smart factory technology in line with Industry 4.0 initiatives,” said Agustin Mosquera, Operations Manager at ACDi. “This technology helps us to operate more efficiently, with increased accuracy and elevates the services we offer our clients.”
About ACDi
Based in Frederick, MD and Nashville, NC, ACDi is an integral resource to companies who need a trusted partner for dynamic electronics manufacturing, engineering and design expertise to successfully bring their electronic products to market. Our product engineering services, PCB layout, NPI, electronics manufacturing services, testing, systems integration and product lifecycle management solutions enable OEMs to focus on their business while we focus on product realization and optimization. ACDi clients gain a hands-on extension to their business as we turn their concepts into functional product. To learn more, click here.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.