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ACDi Strengthens Capabilities of Maryland Facility
October 22, 2018 | PRNewswireEstimated reading time: 1 minute
ACDi has added three new pieces of equipment to their Frederick, Maryland headquarters. The company has purchased, installed and is fully operating Optical Control’s SMD X-Ray Counting Machine, Koh Young’s 3D Solder Paste Inspection Machine and the Zenith3D Automated Optical Inspection Machine.
The Optical Control SMD X-Ray counting machine provides exact inventory knowledge which in turn enables more efficient production and increased on-time delivery. The OC-SCAN®CCX.3 significantly streamlines the electronics manufacturing process and gives an exact outline of single component stocks.
The 3D solder paste inspection system from Koh Young is the fastest solder paste inspection machine available with 3D shadow-free moiré technology, warp compensation and a user-friendly Renewal GUI. It delivers true 3D inspection without concern for inaccuracies resulting from shadowing.
Koh Young’s Zenith 3D automated optical inspection (AOI) platform effectively measures true pro lometric component shapes, foreign materials, patterns and solder joints on assembled PCBs to overcome the vulnerabilities and shortcomings of 2D AOIs.
“With the addition of these systems to our electronics manufacturing facility, the company is adopting smart factory technology in line with Industry 4.0 initiatives,” said Agustin Mosquera, Operations Manager at ACDi. “This technology helps us to operate more efficiently, with increased accuracy and elevates the services we offer our clients.”
About ACDi
Based in Frederick, MD and Nashville, NC, ACDi is an integral resource to companies who need a trusted partner for dynamic electronics manufacturing, engineering and design expertise to successfully bring their electronic products to market. Our product engineering services, PCB layout, NPI, electronics manufacturing services, testing, systems integration and product lifecycle management solutions enable OEMs to focus on their business while we focus on product realization and optimization. ACDi clients gain a hands-on extension to their business as we turn their concepts into functional product. To learn more, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.