Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Shenmao to Exhibit New Solder Alloys at IWLPC
October 22, 2018 | SHENMAO Technology Inc.Estimated reading time: 1 minute
Shenmao Technology Inc. plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place October 23-25, 2018 at the DoubleTree by Hilton San Jose in California. The company will showcase its new PF906-S and PF912-S solder alloys.
Shenmao's high thermal/drop reliability series solder alloys can be used in a wide range of solder applications. The alloys have a similar operating temperature window to Sn-Ag-Cu alloys, so that they can easily be adopted into existing packaging processes.
The PF906-S Sn/Ag4.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal reliability and is designed for use in automotive electronic applications.
The PF912-S Sn/Ag2.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal and impact reliability compared to conventional solder alloys such as SAC305 and SAC405.
Shenmao has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the world’s major solder materials provider, Shenmao produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Shenmao America Inc. blends SMT solder paste at its facility in San Jose, California for distribution in North America.
About Shenmao
Shenmao is dedicated to the production of solder products including water soluble and no-clean solder paste, laser solder paste, solder preforms, cored solder wire, wave solder bar alloys, wave soldering fluxes, extremely pure solder powder up to type 8, BGA and micro BGA solder sphere, wafer level packaging solder paste and fluxes, LED die attach paste, high performance liquid fluxes, solder preform, solar ribbon, plating anode used in PCB fabrication, assembly and semiconductor packaging processes.
For more information, please click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.