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Solstice Advanced Materials to Acquire Element Solutions

07/07/2026 | Element Solutions Inc.
Solstice Advanced Materials and Element Solutions announced that they have entered into a definitive agreement for Solstice to acquire Element in a cash-and-stock transaction valued at approximately $14.5 billion, including the assumption of net debt.

Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027

07/06/2026 | Global Electronics Association
The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place during APEX EXPO 2027 in Anaheim, California.

CG Semi Commences Commercial Production at Its G1 OSAT Facility in Sanand, Gujarat

07/06/2026 | BUSINESS WIRE
CG Semi Private Limited (CG Semi), established as a joint venture between CG Power and Industrial Solutions Ltd. of the Murugappa Group, Renesas Electronics Corporation, and Stars Microelectronics. Headquartered in Gujarat, CG Semi announced the commencement of commercial production at its G1 Outsourced Semiconductor Assembly and Test facility in Sanand.

Teledyne's Emerald 67M Space Camera Enabled by SDL License

07/06/2026 | BUSINESS WIRE
Teledyne Digital Imaging US, Inc., a Teledyne Technologies company, announced a new high-resolution space-ready camera based on its Emerald™ 67M CMOS image sensor.

50 Years in Fehring: AT&S Invests Millions in Future of Site in Austria

07/03/2026 | AT&S
AT&S is celebrating the 50th anniversary of PCB volume production at its Austrian site in Fehring and sending a strong signal for the future: With another multi-million euro investment, the company is strengthening its expertise in the PCB business and opening up new growth opportunities in strategically important future markets.
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