Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
CyberOptics Will Demonstrate MRS-Enabled SQ3000 for AOI, SPI and CMM at electronica 2018
October 24, 2018 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation will exhibit at electronica 2018, scheduled to take place November 13-16, 2018 at the Messe Munchen in Munich, Germany. The company will demonstrate the MRS-Enabled SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications in hall A3, booth # 272.
The SQ3000 offers a combination of unmatched accuracy and speed with the industry-leading multi-reflection suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the proprietary MRS technology an ideal solution for a wide range of applications with exacting requirements.
The SQ3000, deemed best-in-class, has been widely used for 3D automated optical inspection (AOI) and can now be used for 3D solder paste inspection (SPI) for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the award-winning, easy-to-use SPI software, SPI has reached a new level of precision for the most stringent requirements.
Additionally, the SQ3000 can be used to attain highly accurate coordinate measurements faster than a traditional coordinate measurement machine (CMM) – in seconds, not hours. The world’s first in-line CMM includes a comprehensive software suite for use in industrial metrology, semiconductor, microelectronics and SMT applications.
Customers worldwide are using the SQ3000 3D inspection and measurement system to improve yields, quality and operational efficiencies in their manufacturing facilities.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
For more information, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.