Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
New EU Chemicals Database on Candidate List Substances in Articles by 2021
October 25, 2018 | IPCEstimated reading time: 1 minute
As part of the European Union’s “circular economy” policy, EU officials want to expand the secondary raw materials market. The potential presence of chemicals of concern in recycled materials is seen as a potential barrier to the development of this market. Therefore, the European Chemicals Agency (ECHA) is working to establish a new database on the presence of hazardous chemicals in articles by the end of 2019 to inform both waste treatment operators and consumers. The database will comprise information submitted by companies producing, importing or selling articles that contain Candidate List substances, meaning Substances of Very High Concern (SVHCs). Companies will need to submit this information by the end of 2020.
The legal basis for this database is the recently revised EU waste framework directive, which entered into force last July. It is part of the EU’s waste legislation package, aimed at contributing to the EU’s move towards a circular economy by improving the risk management of chemicals during waste recovery while promoting non-toxic material cycles. At the same time, this database will increase the pressure on industry to substitute substances of concern.
IPC’s Senior Director of Europe, Nicolas Robin, and the IPC 2-18b Committee are working closely with ECHA and the European Commission to convey IPC members’ concerns and ensure that new requirements do not create inappropriate reporting burdens for companies. The committee has provided a comprehensive response to ECHA’s recent public consultation on the topic. In addition, IPC is looking at how the widely-used standard, IPC-1752A, might be able to meet all of ECHA’s requirements for reporting into the new candidate list database, facilitating the uptake of existing declarations data, and making it easier to use the database.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.