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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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RTW SMTAI: MacDermid's Lenora Clark Talks Automotive Electronics Trends
October 25, 2018 | Real Time with...SMTAIEstimated reading time: Less than a minute
Lenora Clark, director for end-user applications at MacDermid, discusses with I-Connect007 Managing Editor Nolan Johnson some of the trends happening in the automotive electronics industry. She talks about how her company is educating their customers in the automotive electronics sector on the available technologies in other markets such as military and aerospace, telecommunications—even the handheld market—and how they can adopt these technologies in their industry.
Suggested Items
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Honda Changes Plan to Build New Production Plant for Next-generation Fuel Cell Module in Japan
07/01/2025 | HondaHonda Motor Co., Ltd. has decided to make changes to the previously announced plan to begin operation of a plant in Moka City, Tochigi, Japan, dedicated to production of the next-generation fuel cell module.
Trimble, TDK Join Forces to Accelerate Precision Navigation
06/25/2025 | PRNewswireTrimble® and InvenSense, a TDK group company, announced they will work together to deliver an advanced navigation solution that combines the Trimble ProPoint® Go engine and Trimble RTX® correction service with TDK's SmartAutomotive™ Inertial Measurement Units (IMUs) module from InvenSense.
Qualcomm Acquires Autotalks to Boost V2X Deployments
06/06/2025 | Qualcomm IncorporatedQualcomm Incorporated announced that its subsidiary, Qualcomm Technologies, Inc., has completed the acquisition of Autotalks, an industry leader in direct vehicle-to-everything (V2X) communication solutions.
Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
06/05/2025 | Cadence Design Systems, Inc.Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.