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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
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Consultation on EU’s Chemical, Product and Waste Legislation
October 26, 2018 | IPCEstimated reading time: 1 minute
The European Union promotes a “circular economy” with closed-loop production based as much as possible on repairability, reusability and recycling. But in order for more products to be recycled or reused, it is crucial to tackle the challenges at the source, by ensuring that the product design facilitates recycling, and by substituting, whenever feasible, hazardous substances with suitable alternatives.
In this context, the European Commission recently asked stakeholders their opinions on the interface between chemical, product and waste legislation. The questionnaire drafted by the European Commission covers some key issues for the electronics industry, including the definition of ‘substances of concern’ and the tracking of these substances.
Based on Commission’s communication on this subject, the aim of the questionnaire is to get stakeholders’ views on four issues posing obstacles to ‘the safe uptake of secondary raw materials’ and a number of related challenges: lack of information on substances of concern in products and waste; presence of substances of concern in recycled materials; difficulties in applying end-of-waste criteria; and unclear application of EU waste classification methodologies.
This is one of the priority issues for the electronics industry in Europe, and IPC’s Senior Director of Europe, Nicolas Robin, is currently working with IPC members on a common response to the consultation. Please don’t hesitate to share your views and concerns. The deadline has been set for October 29, 2018.
The European Commission’s key Policy Officer responsible for the interface between chemical, product and waste legislation, Enrique Garcia-John, will be one of the speakers at this year’s IPC IMPACT Europe on November 28-29 in Brussels. Register now to speak directly with high level EU decision-makers, make your voice heard, and better understand future EU legislative plans.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.