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Indium to Feature New Solder Paste at SMTA Guadalajara
October 30, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will help attendees Avoid the Void by featuring its ultra-reliable Indium8.9HF Solder Paste series at SMTA Guadalajara Technical Forum and Expo, November 14-15 in Guadalajara, Mexico.
Indium8.9HF is an air reflow, no-clean solder paste that has been tested and approved for use in the automotive electronics industry.
The Indium8.9HF series enhances the reliability of automotive products in three ways:
- Improves thermal conductivity and thermal reliability with industry-proven low-voiding performance
- Enhances mechanical reliability, which allows for stable and consistent performance under harsh environments
- Provides higher electrical reliability with an enhanced SIR
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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