Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
Zymet to Feature Reworkable Edgebond Adhesive at IPC APEX EXPO
October 30, 2018 | ZymetEstimated reading time: 1 minute
At the IPC’s APEX EXPO, Zymet will be featuring a reworkable edgebond adhesive that has recently been shown to be capable of significantly enhancing the board level reliability (BLR) of low temperature solder (LTS) assemblies. Low temperature solders are the subject of growing interest for their ability to reduce energy consumption, reduce warpage and increase assembly yields, and as a path to more complex assemblies. Though the BLR of LTS assemblies can be quite good, there are still packages that do not perform well enough on their own, particularly in high reliability or harsh environment applications. Using an underfill to overcome deficient BLR performance is a less-than-ideal process, requiring board preheat to facilitate underfill flow, dwell times to wait for underfill flow, while yielding encapsulation outcomes that cannot be 100% verified by AOI. Edgebonding, on the other hand, is quick and completely verifiable. Figure 1 illustrates the use of an edgebond adhesive both in a corner-only configuration and in a full-edgebond configuration. Both configurations enhance BLR. The reworkable edgebond adhesive also enhances the mechanical shock or drop test reliability of assemblies.
Zymet welcomes visitors to stop by its booth to collect more information or to discuss the use of reworkable edgebond adhesives. Representatives of Zymet will be at booth #1350, APEX EXPO 2019, January 29- 31, 2019, at the San Diego Convention Center, Sand Diego, California, USA.
About Zymet
Zymet is a global supplier of adhesives and encapsulants, focused on the development and manufacture of enabling materials for the electronics industry.
Share on:
Suggested Items
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).