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MacDermid Performance Solutions to Integrate Electronics Chemicals and Assembly Materials Businesses
October 30, 2018 | MacDermid Performance SolutionsEstimated reading time: 1 minute
MacDermid Performance Solutions announced that effective January 1, 2019, it will combine its Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions business units to form MacDermid Alpha Electronics Solutions, a $1.2 billion electronics chemicals and materials business, headquartered in Waterbury, Connecticut, USA.
By integrating its two electronics businesses, MacDermid Performance Solutions will have a more complete view of the electronic pathway, allowing the company to accelerate innovation in chemistries, materials and processes. The combined business will be uniquely positioned to help customers overcome technical challenges and deliver more creative and reliable solutions, due to a collaboration of experts spanning the broader electronics ecosystem.
“The integration of Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions will allow us to better leverage our deep expertise of the entire electronics supply chain,” said Scot Benson, president of MacDermid Performance Solutions. “As one business, our experts will have the tools they need to design high-reliability solutions for the industry’s most difficult technology challenges and provide industry-leading technical support that helps our customers win in the marketplace.”
About MacDermid Performance Solutions
MacDermid Performance Solutions is a subsidiary of Platform Specialty Products Corporation. Our companies manufacture a broad range of specialty chemicals and materials which are used in multi-step technological processes that enhance the products people use every day. Our innovative materials and processes are creating more opportunities and efficiencies for companies across key industries – including electronics, graphic arts, metal & plastic plating, and offshore oil production.
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Klaus Koziol - atgSuggested Items
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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