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Indium to Feature Proven Solder Paste at CSPT 2018
November 1, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ 75 Solder Paste at China Semiconductor Packaging and Test Seminar (CSPT) 2018, November 19-21 in Hefei, Anhui, China.
NC-SMQ 75 is an ultra-low residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable residue.
NC-SMQ75's unique formulation has been proven in demanding high-reliability applications, and features:
- Ultra-low post-reflow residue
- “Power-Safe” residue compatible with overmolding compounds without delamination
- Consistently good wetting with common metal finishes
- Dispenses without clogging for powder types 3, 4, 5, and 6
- Wide range of alloy compatibility, including high-Pb alloys
Along with NC-SMQ 75, Indium Corporation has a wide array of proven die-attach products to cater to multiple applications, such as system-in-package, flip-chip, and more.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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