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pH Neutral Defluxing Agents to be Featured by ZESTRON at SMTA Guadalajara
November 1, 2018 | ZESTRONEstimated reading time: 1 minute
ZESTRON will be promoting the latest in pH neutral solutions for high precision cleaning at the SMTA Guadalajara Expo and Tech Forum.
Since the introduction of its first pH neutral defluxing agent in 2010, ZESTRON has continually expanded its VIGON® and HYDRON product families with solutions for use in the high precision cleaning of electronic assemblies and advanced packages for military, automotive, aerospace, and consumer electronics markets.
ZESTRON’s environmentally-friendly, pH neutral cleaning agents deliver uncompromised cleaning results to customers working with today’s low standoff component heights and higher component density while offering excellent material compatibility and a safer working environment.
The SMTA Guadalajara Expo and Tech Forum will be held at the Expo Guadalajara, on November 14-15.
About ZESTRON
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the global leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. With eight worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please click here.
For more information or to register, please click here.
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Rachael Temple - AlltematedSuggested Items
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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