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Goepel electronic's New 3D Camera Module for Stand-Alone AOI System Basic Line
November 6, 2018 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic's stand-alone AOI system "Basic Line" can now be equipped with a new 3D camera module. This allows cost-effective 3D measurement and 2D inspection even for SMD manufacturers with small batch sizes.
The 3D·ViewZ camera module combines 3D measurement technology based on structured light with angled-view inspection from 360 possible angles, allowing maximum fault detection even in difficult-to-view component situations. The Basic Line·3D is an AOI system for manual and flexible loading of different circuit boards, making it particularly suitable for electronics manufacturers in the high mix/low volume sector.
Due to the flexible configuration variants (angled-view, rotary drive, PCB size) it can be specifically adapted to the respective requirements. A special added value of the system is the possibility of using the system for 3D solder paste inspection.
The MagicClick software tool provides significant time savings in the creation of AOI test programs. With no existing library entries, it generates a production-ready test program including component library within a few minutes. The assembly-specific layout is taken into account by importing and automatically analyzing CAD data. Parametrization and optimization is also fully automated and based on real process fluctuations. In total, the time saving for test program creation and optimization is up to 80%. Thus a return-on-investment is already possible after a short time
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.