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Alpha Assembly Solutions to Feature Innovative Solder Technologies and Recycling Services at SMTA Silicon Valley
November 7, 2018 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will feature its latest innovations in interconnect technologies and its solder debris recycling capabilities at the SMTA Silicon Valley Conference and Expo taking place on November 28, 2018 at the Bestronics Box Build Facility, San Jose, California.Alpha will be co-exhibiting at this event with its distributor partner, Krayden Inc.
Alpha will be promoting its newest solutions for void reduction and low temperature soldering, featuring the recently launched ALPHA OM-358 ultra-low voiding paste and the high performing, low temperature paste, ALPHA OM-550.ALPHA OM-358 provides excellent electrical and thermal performance, increasing production efficiency and reducing the amount of rework. “With less than ten percent voiding on bottom terminated components, this paste is well suited to meet the demands of automotive, aerospace, LED, and medical customers who have high reliability requirements,“ said Robert Wallace, Regional Marketing Manager for the Americas.
For low temperature soldering, Alpha will highlight the recently published,The Printed Circuit Assembler’s Guide to...™ Low Temperature Soldering which contains technical articles written by several low-temperature solder experts from Alpha and its ALPHA® OM-550 high performing low temperature paste.ALPHA OM-550 is recongnized in the industry as providing excellent mechanical reliability, drop shock performance, and voiding on a variety of package types, as well as, efficiencies in both energy and costs.
Alpha‘s Recycling Services program will provide information on processes for and value of recycling paste scrap, dross, and debris.As North America’s largest solder recycler, Alpha takes pride in having the safest, most efficient, environmentally-compliant recycling solution that sends no materials to landfills.The Reclaim and Recycling Services are an important component of Alpha’s Sustainability programs.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
About Krayden Inc
Since 1989 Krayden has delivered technical expertise as a problem-solving distributor specializing in adhesives, sealants, solder, and coatings, as well as various types of specialty chemicals and solvents.
Krayden serves a variety of industries including electronics, aerospace, transportation, solar, oil & gas, and OEM manufacturers.
With numerous locations, Krayden provides distribution throughout North America including Canada and Mexico.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges.Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.