Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
I-Connect007 Survey Sees Bright Prospects for Low-Temperature Soldering
November 7, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: 1 minute
There has been an increasing amount of discussion on low-temperature soldering, and solder pastes. And why not? There are several advantages of using low temperature solders—from a technical standpoint and economic perspectives.
First, it will reduce the stress on components and substrates on boards. Low-temperature soldering will lower the energy costs of your reflow ovens, as well as reduce material costs for your assemblies, as you may switch to cheaper substrates and packages. It will also help reduce the warpage of flip chip BGAs for the latest generation of microprocessors, thereby increasing SMT yields.
One question in a recent survey by I-Connect007 on soldering is about the use of low-temperature solders in the assembly process.
According to the results of our survey, majority, or 67% of the respondents will consider using low-temperature solders in their assembly process. Chief among their reasons include less damage to components and the PCB, reduced stress from the CTE mismatch on cooling from reflow, and "because it makes sense."
Those who answered “No”, on the other hand, point to the unpredictability and uncertainty of low-temperature solders in terms of long-term reliability. One respondent noted that low-temperature soldering tends to cause weak soldering connections as well as insufficient heat and time for the flux activation process to take place, thereby impacting the overall reliability of the assembly.
To know more about the results of the survey, look out for the upcoming issue of SMT007 Magazine.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
05/27/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its through-hole technology (THT) assembly processes.