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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

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As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.

Rocket Lab Introduces High-Efficiency Solar Cell

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Silicon Labs Opens New Austin Innovation Center with Support from Texas CHIPS Act

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