Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Kurtz Ersa Picks Up Award for Selective Soldering at SMTA Guadalajara
November 15, 2018 | Kurtz ErsaEstimated reading time: 1 minute
Kurtz Ersa Inc. was awarded a 2018 Mexico Technology Award in the category of Soldering - Selective for its VERSAFLOW 455. The award was presented to the company during a Wednesday, November 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Ersa Vice President of Sales – North America, Ernie Grice stated, “The VERSAFLOW 4/55 demonstrates Kurtz Ersa’s ongoing reaction to the market’s demands for flexibility and throughput. In the changing environment of low-mix to high-volume and high-mix to low-volume, the VERSAFLOW 4/55 has almost an endless configuration of possibilities to meet requirements. We are very pleased to be recognized with this award.”
Ersa presents the future of selective soldering technology with the VERSAFLOW 455, featuring a maximum process window for board assemblies of 508 x 508 mm. This modular selective soldering system can be configured with two fluxer modules, multiple preheat units including upper preheaters and up to three soldering modules.
The wave of innovations continues in the solder module. The Y- and Z- variable solder pots, up to now only available as separate options, are now combined and controllable in the VERSAFLOW 4 software. The parameter Y-variable adjusts the distance of the two solder baths / nozzles automatically to that of the individual boards in a multiple-up. Different multiple-ups with differing offsets can now be processed in mixed production without manual intervention and without loss of time! Also available is the programmable Y-variable for the fluxer. The option Z-variable serves to solder a PCB with two nozzles of different sizes.
The Mexico Technology Awards recognize the best new innovations in the electronics manufacturing industry in Mexico. The goal of the award program is to celebrate the companies and people that are achieving the highest standards and driving the industry forward.
For more information about Kurtz Ersa North America, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.