-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SHENMAO Receives Mexico Technology Award for New Liquid Flux
November 15, 2018 | SHENMAO America, Inc.Estimated reading time: 1 minute

SHENMAO America was awarded a 2018 Mexico Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Wednesday, November 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
SM-862 is a rosin-containing flux designed to leave less residue and minimum bridges. It is a ROL0 (J-STD-004B), tack-free, no-clean flux designed for use in a variety of automated and selective soldering applications. SM-862 produces highly reliable assemblies meeting the toughest reliability requirements. It offers stable quality, good hole-fill, and excellent wettability and solderability.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
The Mexico Technology Awards recognize the best new innovations in the electronics manufacturing industry in Mexico. The goal of the award program is to celebrate the companies and people that are achieving the highest standards and driving the industry forward.
About SHENMAO
SHENMAO is dedicated to the production of solder products including water soluble and no-clean solder paste, laser solder paste, solder preforms, cored solder wire, wave solder bar alloys, wave soldering fluxes, extremely pure solder powder up to Type 8, BGA and micro BGA solder sphere, wafer level packaging solder paste and fluxes, LED die sttach paste, high-performance liquid fluxes, solder preforms, solar ribbons, plating anodes used in PCB fabrication, assembly and semiconductor packaging processes.
For more information, please click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.