-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Zuken Partners with CADENAS and ECAD-Port
November 20, 2018 | ZukenEstimated reading time: 1 minute
Zuken has signed partnership agreements with CADENAS, a provider of online component libraries, and ECAD-Port, a specialized provider of electrical component library services.
The three partners are working together to provide online access to free, validated, high-quality electrical component data to users of Zuken’s E³.series electrical design tools. The agreement will extend the CADENAS offering of intelligent engineering data from more than 700 component manufactures through the addition of electrical content provided directly by OEM component manufacturers. The partnership is expected to rapidly grow the CADENAS library from its current number of 250 electrical, fluid and automation manufacturers. It will achieve these benefits for electrical designers:
- Users of Zuken’s E³.series ECAD environment will gain direct access to the CADENAS component portal where they can search for components and load the required parts directly into E³.series. This digital engineering data are enriched with intelligent information such as electronic symbols, connections points and technical product information.
- ECAD-Port will be available as a service provider to OEMs for content creation and attribute mapping services using both eCl@ss and E³.series formats.
- ECAD-Port will provide mapping assistance to all E³.series customers who operate an E³.database, offering specific attributes or content such as individual ERP number or customer specific symbols.
Through the collaboration with CADENAS, Zuken is building on its commitment to industry standards.
“We have been supporting the eCl@ss initiative for many years,” said Joachim Frank, Managing Director of Zuken E3. “Zuken’s intention was to provide users a reliable source of high-quality manufacturer certified component information. Therefore, CADENAS’ data portal was our first choice.”
Jürgen Heimbach, CEO of CADENAS said, “Our cooperation with Zuken opens new opportunities to the electrical engineering community. Through providing intelligent enriched engineering data, electrical engineers no longer need to manually search and add information. This saves valuable time for their product development.”
The initiative has already seen positive response from leading component manufacturers, with endorsements from HARTING, Weidmüller, Phoenix Contact, WAGO and TE Connectivity Technology Group. Comprehensive libraries from further industry leaders are under way.
For more information:
Suggested Items
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
Gartner Forecasts MENA IT Spending to Grow 7.4% in 2025
11/20/2024 | Gartner, Inc.IT spending in the Middle East and North Africa (MENA) region is projected to total $230.7 billion in 2025, an increase of 7.4% from 2024, according to the latest forecast by Gartner, Inc.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
New Ultrafast Memory Boosts Intel Data Center Chips
11/19/2024 | IntelWhile Intel’s primary product focus is on the processors, or brains, that make computers work, system memory (that’s DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen).
Sluggish Telecom Market Growth Prompts Operators to Become Full-Stack Technology Suppliers
11/18/2024 | IDCWorldwide spending on telecommunications and pay TV services will reach $1,544 billion in 2024, representing an increase of 2.4% year-on-year, according to the Worldwide Semiannual Telecom Services Tracker published by International Data Corporation (IDC).