Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Circuitronics Adds Valor Software Module to Support Customers
November 21, 2018 | CircuitronicsEstimated reading time: 1 minute
Circuitronics has added the Valor Process Preparation Module. The company is now offering evaluations of customer designs prior to prototyping as an optional service for production and prototype customers. The new service increases manufacturability at production launch.
The Valor Process Preparation module is a complete engineering solution for DFx, process development and test engineering for PCB assembly operations. It improves the efficiency and quality of PCB assembly with tools such as optimized front-end DFA analysis, BOM validation, stencil design, SMT programming and line balancing.
Process Preparation (formerly known as vPlan) software by Valor, delivers a complete software solution comprising DFx, SMT, assembly and test engineering for PCB assembly operations.
With a single central database of engineering data based on import of ODB++, native CAD, and BOM files with fully configurable manufacturing process definitions, Valor Process Preparation ensures automated, error-free set-ups and outputs for PCB assembly, test and inspection, right first time, in half the normal time.
About Circuitronics
Circuitronics is a premier electronic manufacturing services (EMS) company that caters to the needs of customers requiring higher technology and reliability in the industrial, energy, mil-aero and communication markets. The company is centrally located and the right size to offer responsiveness, agility and customer focus. Circuitronics offers complete EMS services including PCBA, system assembly, NPI/prototyping, supply chain solutions and advanced engineering services. For more information, click here.
Share on:
Suggested Items
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.
Europlacer Expands U.S. Reach with New Eastern Region Representative
06/30/2025 | EuroplacerEuroplacer, a global leader in flexible SMT assembly solutions for High-Mix manufacturers, is pleased to announce the appointment of Photo Chemical Systems as its new representative for the Eastern United States.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.