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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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ZESTRON South Asia Granted ISO 14001:2015 Certification
November 22, 2018 | ZESTRONEstimated reading time: Less than a minute
ZESTRON is officially certified ISO 14001:2015 for its South Asia operation. ISO defines parameters for compliance with the highest standards of quality, environmental, responsibility, and other characteristics of world-class organizations’ operations across their materials, products, processes and services.
In 2015, ZESTRON Malaysia had obtained ISO 9001:2015 Quality Management System certification, and added with ISO 14000:2015 in 2018. ISO 14001 Environmental Management System certification recognizes companies that have practiced environmental responsibilities in their business processes.
ISO 14001:2015 specifies a set of requirement for planning, implementing, operation and improving an Environmental Management System. In order to effectively implement environmental responsibility, ZESTRON Malaysia took time to develop its own environmental policy, conduct the feasibility trainings, form designated commitee to monitor the progress and ensure the success of the implementation.
“We are proud to receive the ISO certification as a recognition of our effort and commitment to consciously protect the environment for the future generation. We will continue to review our standard in our efforts as a part of an environmentally responsible business community.” said James Yeoh, Executive Director – ZESTRON Malaysia.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.