Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
New NPL Webinar Titles for 2019
November 23, 2018 | Bob Willis, Bobwillisonline.comEstimated reading time: Less than a minute
The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research
The team investigate interconnect properties and develop metrological techniques to characterise performance, frequently in multiple domains. Our research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems
Increasing the Performance of Organic PCBs at Higher Temperatures
17th January
Organic Hybrids for Circuit Assemblies – Initial Environmental Testing of a Low Cost Alternative to Ceramic Substrate Based Assemblies
19th March
Evaluation Of Embedded Electronics For Use In Harsh Environments
21st May
Effect of Bias (up to 1000V) on Conductive Anodic Filament (CAF) Failures of Electronic Circuits
16th July
Electrical and Thermal Material Evaluation Using Power Cycling Testing For Power Electronic Applications
17th September
Battery Metrology At NPL – Lithium Ion Cell Characterisation
12th November
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