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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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PCB Maker Unitech Pioneers Smart Production to Boost Yield Rates
November 23, 2018 | DigitimesEstimated reading time: 1 minute
Taiwan-based Unitech Printed Circuit Board has taken the lead to incorporate smart manufacturing into the PCB sector, seeking to significantly boost yield rates and tap the market for high value-added PCBs needed for increasingly sophisticated electronics devices, Digitimes reports.
The firm's vice president L.C. Lee said that PCB production is a highly complicated process involving mechanical, chemical and electronics technologies, and the increasingly complicated designs seen in electronics products has further multiplied the complexity of PCB production. Lee stressed it is a must for PCB production to go smart.
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