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I-Connect007 Research
November 28, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: Less than a minute
In a recent I-Connect007 survey on flex circuits, we asked the following question: What are the major drivers causing you to utilize flex circuits? Here are just a few of the replies, edited slightly for clarity.
Jana Carraway, MicroSystems Engineering Inc.: Ability to miniaturize; interconnect density—blind, buried, stacked vias in thin flex.
Dennis Fritz, SAIC Inc.: Flex circuits have lower costs than hand-made wire harnesses; they can go to high speeds; and they have the ability to fit in small spaces, bend to assemble.
Anton van Achteren, Major Electronics: We produce products that our customers require for their products. We must keep up with the market, and if this is something that can lead to new customers, then this is something we must satisfy.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
ASC Sunstone Circuits to Exhibit at PCB Detroit 2025
05/05/2025 | ASC SunstoneASC Sunstone Circuits will be exhibiting at the inaugural session of PCB Detroit to be held on June 2 and 3 on the campus of Wayne State University.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.