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I-Connect007 Research
November 28, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: Less than a minute
In a recent I-Connect007 survey on flex circuits, we asked the following question: What are the major drivers causing you to utilize flex circuits? Here are just a few of the replies, edited slightly for clarity.
Jana Carraway, MicroSystems Engineering Inc.: Ability to miniaturize; interconnect density—blind, buried, stacked vias in thin flex.
Dennis Fritz, SAIC Inc.: Flex circuits have lower costs than hand-made wire harnesses; they can go to high speeds; and they have the ability to fit in small spaces, bend to assemble.
Anton van Achteren, Major Electronics: We produce products that our customers require for their products. We must keep up with the market, and if this is something that can lead to new customers, then this is something we must satisfy.
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05/17/2024 | TAIFLEX Scientific Co. LtdTaiflex Scientific Co., Ltd., a global leader in advanced flexible printed circuit (FPC) materials, held the grand opening ceremony of its Thailand factory at the Amata City Chonburi Industrial Estate in Chonburi, Thailand.
A Potpourri of Design PD Classes
05/14/2024 | Kelly Dack, I-Connect007What is invention without innovation? What is innovation without capability? Kelly Dack addresses these questions and more in this review of the Professional Development courses at IPC APEX EXPO, including the flex course lead by "Flexperts" Mark Finstad and Nick Koop.
Airbus Finalises Acquisition of Aerovel and Its UAS Flexrotor
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All Flex Solutions Hires Mike Madetzke as Manager of R&D
05/08/2024 | All Flex SolutionsAll Flex Solutions is very pleased to announce that Mike Madetzke has joined their team as their new Manager of Research and Development.
Flex Announces Upcoming Changes to Its Board of Directors
05/07/2024 | FlexFlex announced that consistent with its succession plan, Michael D. Capellas, non-executive Chair of the Board of Directors of Flex, has informed the Board of his decision not to stand for re-election to the Board at the company's 2024 Annual General Meeting of shareholders to be held on August 8, 2024. Mr. Capellas has served on the company's board for 10 years, including as Chair since 2017, during which time he played a key role in building Flex's reputation as a trusted global technology, supply chain and manufacturing solutions partner and driving the company's success.