-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rocket EMS Names Dave Doering Head Of Business Development Midwest
November 29, 2018 | Rocket EMSEstimated reading time: 1 minute
Rocket EMS welcomes Dave Doering as head of business development Midwest. Working remotely from Chicago, Dave will facilitate Rocket’s relationships with existing clients and spearhead its growth initiative in targeting production and NPI customers in the Midwest.
Doering comes to Rocket EMS with over 20 years of successful sales experience, 17 of them microelectronics. His expertise includes manufacturing service, design service, test development, and component sales.
“I was attracted to Rocket because of their extreme dedication to quality along with commitment to on-time delivery and integrity of service. They provide a quality work environment to go along with their great location,” said Doering. “My belief is that value-add awareness, follow-up, quality of service, and integrity are essential.”
Rocket’s proprietary smart factory software, Voyager, will be instrumental in providing extraordinary customer service, flexibility, and quality to clients beyond the Bay Area. Voyager extends complete visibility and transparency to Rocket’s OEM partners. It provides not only materials, quality, and schedules, but also detailed data such as incoming material tracking numbers, solder paste lot codes, and reflow profiles. Rocket EMS is dedicated to delivering unparalleled quality and service while maintaining on-time delivery within complex product and logistic environments.
Rocket’s commitment to its customers is powered by state-of-the-art equipment, and by the talent and expertise of its team. Doering envisions consistent growth and expansion of capabilities for Rocket EMS in the Midwest, while maintaining the high level of excellence that is characteristic of the company.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.