Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
NPL's EI Group Presents New Series of Technical Webinars in 2019
December 10, 2018 | NPLEstimated reading time: Less than a minute
NPL's Electronics Interconnection Group's webinars are now in their eighth year. The Group is internationally recognized for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research.
The team investigates interconnect properties and develop metrological techniques to characterize performance, frequently in multiple domains. Research is focused on the emerging technologies within printed electronics, harsh and high temperature electronics, wearable technology and electrochemical performance in coating barrier systems.
These free online webinars provide the opportunity to draw on years of practical experience without the participant needing to leave his/her desk—to participate, all that is needed is a phone line and Internet access. Please note that registration is essential.
The majority of webinars run for between 60–90 minutes (and are limited to 100 delegate/company registrations). After the webinar, participants receive a copy of all of the slides and a listing of all relevant technical reports which can be downloaded for free.
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