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How to Classify Your Product: Is It Defence, Dual-Use, or Civil?

06/02/2026 | Didrik Bech, CONFIDEE
In my previous article, I discussed the importance of documenting and vetting your supply chain. But even the most transparent and controlled supply chain will not protect a company that does not properly classify its product. Sooner or later, every company operating within technology, electronics, aerospace, drones, telecommunications, software, or defence-related manufacturing will face a question that sounds simple, yet it is often difficult to answer: Is your product defence, dual-use, or civil?

Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing

06/02/2026 | Happy Holden -- Column: Happy’s Tech Talk
New product realization and design for manufacturing and assembly (DFM/A) are becoming increasingly visible as programs that can improve time-to-market and reduce product costs. These simulations of real-time manufacturing are now referred to as digital twins. While many companies are developing such programs, a unifying framework is needed to coordinate their application.

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NOTE Opens New Torsby Plant to Boost Sweden's Defence and Critical Sector Supply

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NOTE has inaugurated a state-of-the-art manufacturing facility in Torsby, Sweden, reinforcing its long-term commitment to delivering technical excellence, local production capacity, and supply chain resilience across defence and other critical sectors.​​​​​​​​​​​​​​

Connect the Dots: What Designers Should Know About Non-conductive Via Fill

05/28/2026 | Matt Stevenson -- Column: Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.
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